Boyke Technology Presents New System Solutions for Thermoset Processing

Designed for the uniform preheating of thermoset transfer molding compounds: the BT T 500-2 high-frequency preheating unit - (Photo: Boyke Technology).

At Fakuma 2026, Boyke Technology GmbH will showcase new machinery and system solutions for processing thermoset molding compounds. The company’s focus will be on integrated combinations of press, mold and compound, as well as a new high-frequency preheating unit for pelletized transfer molding materials.

Machine and mold as an integrated production system
For applications involving complex part geometries and demanding process requirements, Boyke develops transfer and compression molding presses in close cooperation with moldmaking specialists. The objective is to coordinate machine and mold requirements at an early stage of product and process development.

According to the company, combining the press and mold with low-viscosity compounds enables extremely small cavities, down to just a few hundredths of a millimeter, to be filled reliably. Boyke cites applications such as stator production for small electric drives and the encapsulation of hybrid components.

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At Fakuma 2026, Boyke will demonstrate this system approach together with Röttger GmbH & Co. KG, with both companies sharing a booth. Röttger specializes in tool and moldmaking and has expertise in areas including injection molds and hybrid components.

High-frequency preheating for thermoset molding compounds
Another new product on display will be the "BT T 500-2" high-frequency preheating unit, developed for the rapid and uniform preheating of resin-based thermoset molding compounds in pellet form.

Unlike conventional heating methods, the system uses a high-frequency field to heat the material dielectrically from the inside out. The material portions are conveyed through the field on a roller electrode. According to Boyke, this approach helps achieve a more uniform temperature distribution before the subsequent compression or transfer molding process.

Suitable materials include phenolic, melamine, urea (UF) and epoxy resins. The preheating process is particularly intended for applications that require a precisely defined material temperature and process parameters tailored to the specific compound.

Boyke also states that the process can help shorten cycle times and improve the consistency of part quality.

Fakuma 2026
Friedrichshafen, Germany
October 12–16, 2026
Hall A6, Booth 6004

More information: www.boyke-tec.de

Boyke Technology GmbH, Lindlar, Germany

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